Laser-induced chemical liquid-phase deposition of copper on transparent substrates
Laser-induced chemical liquid phase deposition allows maskless manufacturing of metallic structures on the surface of dielectrics and is prospected to be a promising tool in the field of microelectronics and microfluidics. The aim of the work presented here is to combine this deposition method with a related micro-structuring method known as laser-induced backside wet etching. Fabricating both, microstructured surface structures and subsequent deposition of conducting patterns within the same setup would be an interesting tool for rapid prototyping.
To demonstrate the functional principle of this combined approach conductive copper lines were deposited at the backside of both polished and structured soda lime glass substrates by using a focused, scanning ns-pulsed Ytterbium fiber laser at 532nm wavelength. The deposition process is initiated by a photo induced reaction of a CuSO4-based liquid precursor in contact with the backside of the substrate. The obtained metallic copper deposits are crystalline, stable under ambient conditions and have a conductivity in the same order of magnitude as bulk copper.
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